Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing
Applied Materials announced a collaboration with Intel to accelerate development of next-generation transistors, interconnects and advanced packaging for AI computing. Work spans Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon, with Intel as a founding EPIC Center partner covering front-end and back-end-of-line advances plus Foveros-based 3D packaging.
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