Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics
Celestica introduced the DS6005, a co-packaged optics data center switch built on Broadcom's Tomahawk 6 – Davisson chip, delivering up to 102.4Tbps of switching capacity in a fully liquid-cooled 1.5OU ORv3 form factor. The platform targets next-generation AI data center networks, using co-packaged optics to eliminate front-panel pluggable modules and improve power efficiency, latency, and bandwidth density.
Key figures
- Ports
- 64 x 1.6TbE
- Form factor
- ORv3 1.5OU
- Switch chip
- Broadcom Tomahawk 6 – Davisson
- Switch capacity tbps
- 102.4Tbps
AI analysis
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