nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution
nVent and AMD announced a collaboration to integrate nVent's liquid and air cooling, including its dual rear door heat exchanger, into the AMD Helios Rackscale AI platform. The companies will give a first look at the open solution at the OCP Global Summit in San Jose, October 12-16, 2026, at Booth #A9.
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