IBM and Siemens Collaborate on Research to Advance Nanostack Architecture
IBM and Siemens announced a research collaboration to advance IBM's nanostack, a 3D nanosheet-based transistor architecture first unveiled earlier this year. Siemens contributes EDA, process simulation, lithography optimization, and manufacturing software expertise to accelerate development beyond the current 7 angstrom node, targeting nearly 100 billion transistors in a fingernail-sized space.
Key figures
- Node
- 7 angstrom
- Transistor count
- nearly 100 billion
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