ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool
ACM Research shipped its first 310 x 310 mm Ultra ECP ap-p panel-level horizontal electroplating production tool to a customer in Asia outside mainland China. The company says this is the world's first production tool of this panel size, following last year's 515 x 510 mm R&D tool shipment, and supports Cu, Ni, SnAg and Au plating for advanced packaging.
Key figures
- Panel size
- 310 x 310 mm
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