Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
Qnity introduced two new advanced packaging materials for organic interposer applications: Intervia 8540HSP copper and Cyclotene DF6800M dry film photo-imageable dielectric. The materials are engineered to support AI-driven GPU packaging, offering high-reliability metallization and fine-feature patterning for glass-based substrates.
Key figures
- Event date
- June 10–12, 2026
- Event name
- JPCA Show 2026
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