Vishay Specialty Thin Film Introduces Thin Film Metallized Submount Platform
Vishay Intertechnology introduced a new thin film metallized submount platform designed to support next-generation optical transceivers, RF modules, and advanced packaging. The platform leverages aluminum nitride substrates to provide high thermal conductivity and precision alignment, specifically optimized for 800G, 1.6T, and 3.2T optical transceivers.
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