GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
GlobalFoundries announced the production readiness of its SLATE wafer-to-wafer bonding technology on the 9SW RF-SOI platform, enabling advanced 3D integration for cellular front-end modules. The technology is expected to ramp to volume production in the second half of 2027 and can reduce overall die size by up to 45% while delivering more than a 20% enhancement in efficiency.
Key figures
- Die size reduction
- up to 45%
- Volume ramp timing
- second half of 2027
- Efficiency enhancement
- more than 20%
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