ACM Research Expands Ultra C Tahoe into a Wet Processing Platform
ACM Research expanded its Ultra C Tahoe system into a multi-process wet processing platform that supports a broader range of applications for logic and memory device manufacturing. The new hybrid architecture integrates batch and single wafer processes to reduce chemical consumption and cycle time, with the Tahoe Recycle application now running in volume production at customer facilities.
Key figures
- Particle count
- < 6 particles at 26 nm
- Surface metal contamination
- < 1 × 10⁹ atoms/cm²
- Chemical consumption reduction
- up to 75%
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