Coherent Begins Customer Sampling of 300mm High Thermal Conductivity Silicon Carbide Substrates for AI Infrastructure
Coherent has begun customer sampling of its 300mm high thermal conductivity silicon carbide substrates to leading AI semiconductor partners. The new substrates are engineered to improve heat spreading by up to 25% more than current solutions, addressing thermal constraints in AI and high-performance computing systems.
Key figures
- Efficiency improvement
- up to 25%
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