IBM Connects Its First Modular Cryogenic Systems in Milestone Toward Fault-Tolerant Quantum Computing
IBM successfully connected and cooled two modular cryogenic systems to below 15 millikelvin, achieving a key engineering milestone on its path to delivering a fault-tolerant quantum computer by 2029. The new architecture allows modules to connect in a tight row using "L-coupler" technology, providing up to 12 times more wiring space to link hundreds of quantum chips into a single system.
Key figures
- Cooling time days
- under 5
- Module dimensions
- 8 feet tall and 8 feet wide
- Target qubits 2027
- at least 1,000
- Roadmap target year
- 2029
- Temperature millikelvin
- <15
- Wiring capacity increase
- 12 times
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