Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions
Qnity introduced a scalable materials solution platform integrating metallization, bumping, dielectric, and fine-line patterning to support AI-driven advanced packaging. The platform supports architectures like CoWoS, EMIB, and HBM, enabling 2 µm line/space metallization and precise plating control for 2.5D, 3D, and panel-level designs.
Key figures
- Line space
- 2 µm
- Film thickness
- 200–320 μm
AI analysis
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