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Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture

$AIPPress releaseSep 15, 2026, 7:30 PM ETRead the release

Arteris introduced FlexGen Multi-Die, a new network-on-chip IP product extending its multi-die portfolio for non-coherent AI and high-performance computing architectures, alongside Ncore Multi-Die for cache-coherent systems, Magillem integration automation and Cycuity hardware security assurance. The company says FlexGen supports bidirectional transactions over a single UCIe PHY, cutting PHY area, power and I/O requirements by up to 50% as chipmakers transition from monolithic SoCs to chiplet-based designs.

Key figures

Availability
available today to early access partners and strategic customers
Phy efficiency claim
up to 50% reduction in PHY area, power and I/O requirements via bidirectional transactions over a single UCIe PHY

AI analysis

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    AIP: Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture — AI Analysis | Signal8