onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
onsemi unveiled the Embedded Power Platform (EPP), a power-delivery architecture that uses the silicon wafer itself as the package and integrates silicon, SiC and GaN dies into a single wafer-level device. The company claims up to 3-5x higher power density versus current solutions, with early EV traction-inverter designs showing up to 4x density and 15% lower power losses, and an early EPP-based solid-state circuit breaker roughly 50% smaller and 20% cooler than existing designs. Subaru Corporation is one of the first early engagement partners, gaining access to engineering samples and simulation models to evaluate the platform for future electrified vehicle architectures.
Key figures
- Wafer size
- 12-inch
- Sampling start
- 2026
- Ev power density
- up to 4x
- Development cycle
- as little as four months
- Ev power loss reduction
- 15%
- Power density improvement
- 3-5x vs current solutions
- Solid state breaker thermal
- 20% cooler
- Solid state breaker size reduction
- approximately 50% smaller
AI analysis
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