GLOBALFOUNDRIES Inc.

GlobalFoundries Reports Third Quarter 2026 Financial Results

GlobalFoundries reported Q3 2026 revenue of $1.899 billion, up 13% year-over-year, with a record non-IFRS gross margin of 31.4% (+540bps YoY) and non-IFRS diluted EPS of $0.53, up 29% YoY. The IFRS net loss of $(270) million was driven by a $441 million non-cash charge from issuing 9.9 million shares to the U.S. government; cash generation remained solid with $341 million in operating cash flow and $136 million adjusted free cash flow. Growth was led by record YoY revenue in communications infrastructure and data center, alongside strength in automotive and IoT. Strategic wins during the quarter include selection for two new fabs under a U.S.-Japan initiative with up to $21 billion in funding, a $955 million CHIPS Act reallocation, and a $2 billion multi-year agreement with TSMC for U.S.-based silicon interposers. Q4 guidance calls for revenue of $2.0 billion ±$25M with non-IFRS EPS of $0.59 ±$0.05, and the board approved a $0.12 dividend payable January 14, 2027.

•4d ago

GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative

GlobalFoundries was selected as technology provider and operator for two new semiconductor fabs at its Malta, New York site under a U.S.-Japan initiative providing up to $21 billion in funding, with Japan supplying the investment. An initial ~$10 billion will fund the first 300mm fab, expected online in 2029 and adding ~900,000 wafers of annual capacity; an additional ~$10 billion would fund a second fab of similar scale. GF also agreed to reallocate $955 million of its CHIPS Act award toward silicon photonics, SiGe and advanced packaging. As part of a separate agreement, the U.S. Department of Commerce will receive approximately four percent equity in GF. Anchor customers Apple, GM, Renesas and Cirrus Logic voiced support, and GF will host an investor webcast at 1 p.m. EDT on October 14.

•25d ago

GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI

GlobalFoundries celebrated the topping-out of its €1.1 billion SPRINT expansion in Dresden, on schedule and on budget, targeting more than one million 300mm wafers of annual capacity by the end of 2028. The company also announced FDX Fusion, a next-generation fully depleted silicon-on-insulator platform for energy-efficient Physical AI applications, targeting 7nm-like digital performance with analog, mixed-signal, embedded-memory and RF capabilities. Development of FDX Fusion will proceed through the EU-backed IPCEI AST program, subject to German federal government approval, reinforcing Dresden's position as Europe's largest foundry site.

•0mo ago

GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI

GlobalFoundries unveiled FDX Fusion, a next-generation FD-SOI platform targeting 7nm-class digital performance for Physical AI workloads, with manufacturing planned to begin in 2028 at its Dresden facility. The platform promises more than 2x density improvement over first-generation FDX, RF performance up to 0.5 THz ft/fmax, in-memory computing and embedded non-volatile memory, with demonstrator silicon in early 2027 and a PDK release in mid-2027. Major customers and partners including BMW, Bosch, Infineon, NXP, Siemens and Tesla endorsed the roadmap, and Dresden expansion is supported under the European Chips Act.

•0mo ago

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

GlobalFoundries announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. GF will add fabrication capacity at its Malta, New York facility, creating the first U.S.-based source of interposers including embedded deep trench capacitor components, with volume production expected to ramp in the first half of 2028. The agreement has an initial term of five years and provides a framework for future capacity expansion, supporting demand for high-performance computing and AI systems.

•1mo ago

GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity

GlobalFoundries and Marvell Technology announced an expanded multi-year agreement to increase capacity for GF's silicon germanium (SiGe) technology at its Burlington, Vermont facility, targeting next-generation optical connectivity for AI data centers. The SiGe capacity supports 200G-per-lane pluggable optical transceivers as well as Near-Packaged Optics (NPO) and Co-packaged Optics (CPO) architectures, and builds on more than a decade of collaboration between the two companies. No financial terms, volume commitments, or capacity figures were disclosed, but the agreement ties GF directly into the AI interconnect buildout and reinforces the high-performance RF and analog franchise behind its data center optics business.

•1mo ago

GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions

GlobalFoundries and Monolithic Power Systems signed a long-term manufacturing agreement that will deploy MPS's proprietary process technology at GF's advanced 300mm facility in Singapore. Capacity expansion targets power management solutions for automotive architectures, industrial robotics and automation, and smart power stages for AI and cloud infrastructure, with production expected to ramp in early 2027. No financial terms were disclosed, but for GF the deal adds a committed high-growth customer to its Singapore fab and deepens its exposure to AI power and electrification demand.

•1mo ago

GlobalFoundries and U.S. Department of Commerce finalize $375M R&D award to advance American quantum leadership

GlobalFoundries has finalized a definitive agreement with the U.S. Department of Commerce's CHIPS Research and Development Office for a $375 million R&D award to accelerate its Quantum Technology Solutions business. The funding is capped at $375 million over a five-year period and is tied to the achievement of specified milestones, supporting a secure U.S.-based ecosystem for quantum chip development and manufacturing. GF also recently entered a $300 million letter of intent with the same office for silicon photonics R&D; the company positions quantum computing and next-generation optical connectivity as foundational to future AI infrastructure. The award is non-dilutive government funding, but disbursement is contingent on milestone achievement, so timing and full realization carry execution risk.

•2mo ago

GlobalFoundries announces customer availability of UX platform technologies for intelligent edge, connectivity and Physical AI applications

GlobalFoundries announced process design kit availability for its UX platform family, two CMOS technologies — 40UX at 40nm and 22UX at 22nm — purpose-built for intelligent edge devices, wireless connectivity and Physical AI applications. The 40UX platform targets secure microcontrollers, wearables, IoT and Bluetooth Low Energy devices, building on a 40nm platform that has shipped more than one million wafers; it ramps to volume production in Singapore by 2027 with future output planned for Malta, New York. The 22UX platform is an analog-optimized 22nm node for edge AI, imaging and mixed-signal systems, to be manufactured at GF's Dresden, Germany facility with a roadmap to multi-site production. Both platforms are available now for customer engagement and prototyping through GF's GlobalShuttle multi-project wafer program, with quarterly shuttles scheduled through 2027.

•2mo ago

GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform

GlobalFoundries and RAAAM Memory Technologies announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology, marking a milestone with the successful tape-out of a GCRAM test chip on GF's FDX FD-SOI platform. The co-designed GCRAM bitcell achieves a 40% memory area shrink and up to 60% memory power reduction versus SRAM, targeting the on-chip memory bottleneck in edge AI, automotive, and IoT devices. GCRAM design access for lead customers is planned for early 2027. NXP Semiconductors is closely evaluating the solution, lending early ecosystem validation. For GF, the deal enhances the FDX platform IP offering and supports its differentiated-power positioning, though no financial terms or revenue impact were disclosed.

•2mo ago

GlobalFoundries Selects Redpanda to Unify Real-Time Data and Power AI Agents Across its Global Manufacturing Footprint

GlobalFoundries selected Redpanda to build a unified real-time data platform that connects manufacturing, engineering and business systems across its global operations. The platform replaces legacy infrastructure to support a new generation of AI-driven capabilities, with Tier-0 mission-critical systems already live in production. GF plans to expand adoption of the Agentic Data Plane to drive automation and insights across IT, procurement and other business functions.

•2mo ago

SEALSQ's SEALQuantum Sovereign Quantum Vertical Stack Interconnects Its Growing Ecosystem as $200 Million SEALQuantum.com Initiative Enters Second Phase of Deployment in September

Partner SEALSQ announced the second phase of its $200 million internal capital allocation for the SEALQuantum initiative, relying on GlobalFoundries as the manufacturing base for its quantum stack. The company has deployed over $65 million to date and earmarked an additional $100 million through 2027 to integrate partners like Quobly and EeroQ onto GFS's CMOS-compatible platform. This expansion deepens the strategic MoU with GlobalFoundries, positioning its foundry as the central hub for the ecosystem's post-quantum semiconductors and secure communications infrastructure.

•3mo ago

GlobalFoundries Reports Second Quarter 2026 Financial Results

GlobalFoundries reported Q2 revenue of $1.786 billion, up 6% year-over-year, with revenue and Non-IFRS gross margin exceeding the high end of guidance ranges. The company paid its first-ever quarterly dividend of $0.12 per share and completed the acquisitions of Photeon Technologies and Synopsys’ ARC Processor IP business. Strategically, GF signed a letter of intent for a $300 million award from the U.S. Department of Commerce for silicon photonics and expects a $375 million grant for its Quantum Technology Solutions unit. For the third quarter, management guided to revenue of $1.885 billion plus or minus $25 million and Non-IFRS diluted EPS of $0.51 plus or minus $0.05.

•3mo ago

GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership

GlobalFoundries signed a letter of intent with the U.S. Department of Commerce for a potential $300 million award to accelerate the development of next-generation silicon photonics for AI infrastructure. The agreement includes a separate provision granting the U.S. government an approximate 1% equity stake in GlobalFoundries, intended to let the public share in the company’s growth. The funding will support R&D in optical materials and packaging at GF's U.S. facilities, drawing endorsements from major customers like NVIDIA, AMD, and Microsoft regarding the critical need for optical interconnects in scaling AI workloads.

•3mo ago

SEALSQ and GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies

GlobalFoundries and SEALSQ announced a strategic MoU to co-develop Post-Quantum Cryptography and quantum computing technologies on secure semiconductor platforms. The partnership will focus on creating PQC security IP, secure chiplet architectures, and a CryoCMOS ecosystem to support future quantum systems. This collaboration leverages GF's U.S. manufacturing capabilities and SEALSQ's security expertise to align with sovereign supply chain objectives.

•4mo ago

GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications

GlobalFoundries announced the production readiness of its SLATE wafer-to-wafer bonding technology on the 9SW RF-SOI platform, enabling advanced 3D integration for cellular front-end modules. The technology is expected to ramp to volume production in the second half of 2027 and can reduce overall die size by up to 45% while delivering more than a 20% enhancement in efficiency. An integrated process design kit is now available through the GF Connect portal, with prototyping access offered via the GlobalShuttle program in the second half of the year.

•4mo ago

GlobalFoundries joins U.S. Department of Energy's Genesis Mission as industry partner

GlobalFoundries announced a strategic partnership with the U.S. Department of Energy's Genesis Mission to accelerate AI and advanced computing research. The agreement grants Genesis Mission researchers access to GF's U.S. manufacturing platform, design enablement resources, and multi-project wafer program for prototype fabrication. GF Labs will lead the collaboration, focusing on AI-enabled chip design, silicon photonics, and quantum computing, bridging the gap between academic research and commercial silicon production.

•5mo ago

GlobalFoundries completes acquisition of Synopsys’ Processor IP Solutions Business, delivering a holistic technology platform for Physical AI

GlobalFoundries has completed its acquisition of Synopsys’ ARC Processor IP Solutions business, integrating it with its existing MIPS subsidiary. This move establishes GF as a holistic technology partner offering a complete software-to-silicon capability for Physical AI, combining RISC-V processor IP, software tools, and advanced manufacturing. The expanded portfolio includes over 150 patents and serves more than 300 IP customers, strengthening GF’s position in automotive, industrial robotics, and embedded systems markets.

•5mo ago

Sivers & GlobalFoundries Advance AI Data Center Optical Solutions

GlobalFoundries announced a strategic collaboration with Sivers Semiconductors to develop advanced silicon photonics solutions for AI data centers. Sivers' laser arrays will be integrated into GF's silicon photonics platform and its SCALE™ optical engine solutions, supporting co-packaged optics (CPO) and linear pluggable optics (LPO) architectures. The partnership targets the $25 billion pluggable optics market by 2030, leveraging GF's manufacturing capabilities and Sivers' laser technology to address rising bandwidth and power efficiency demands in AI infrastructure.

•5mo ago

GlobalFoundries launches Quantum Technology Solutions to scale U.S. quantum manufacturing

GlobalFoundries launched Quantum Technology Solutions, a dedicated business unit to scale manufacturing for utility-scale quantum computing using its cryogenic CMOS and advanced packaging capabilities. The initiative is anchored by a letter of intent for $375 million in funding from the U.S. Department of Commerce, alongside a strategic equity investment giving the U.S. government a 1% ownership stake in GF. Major industry players including Google, Microsoft, NVIDIA, PsiQuantum, and Quantinuum endorsed the move, highlighting GF’s role in providing a secure domestic manufacturing base for diverse qubit modalities.

•5mo ago

GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day

GlobalFoundries announced its first-ever quarterly dividend of $0.12 per share, payable on July 14, 2026 to shareholders of record as of June 24. The company unveiled a new capital allocation framework targeting the return of up to 50% of trailing twelve-month Non-IFRS adjusted free cash flow to shareholders through dividends and share repurchases. Management emphasized that a broadening technology roadmap for AI-centric markets underpins its expectations for durable growth and expanding profitability through the end of the decade.

•6mo ago

GlobalFoundries Reports First Quarter 2026 Financial Results

GlobalFoundries reported Q1 revenue of $1.634 billion, up 3% year-over-year, with Non-IFRS EPS of $0.40, an 18% increase from the prior year. Profitability improved significantly, with Non-IFRS gross margin rising 510 basis points to 29.0% and Non-IFRS operating margin increasing 320 basis points to 16.6%. The company issued Q2 guidance for revenue of $1.76 billion and highlighted recent strategic partnerships with Renesas and the launch of its SCALE optical module solution for AI architectures.

•6mo ago

GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution

GlobalFoundries launched the SCALE optical module solution for co-packaged optics (CPO), marking the industry's first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform for AI scale-up architectures. The solution utilizes advanced silicon photonics to enable 8λ and 16λ bi-directional DWDM, offering significant improvements in bandwidth density over traditional copper interconnects. Management states the technology already exceeds OCI MSA requirements and is ready to scale next-generation AI infrastructure.

•6mo ago